| 发明名称 |
METHOD AND APPARATUS FOR CMP CONDITIONING |
| 摘要 |
A CMP system has a polishing table for supporting a CMP pad which a semiconductor wafer is polished. The CMP system has a laser source configured to regenerate the CMP pad through a conditioning process while the CMP pad is disposed on the polishing table. |
| 申请公布号 |
US2014295742(A1) |
申请公布日期 |
2014.10.02 |
| 申请号 |
US201414301910 |
申请日期 |
2014.06.11 |
| 申请人 |
APPLIED MATERIALS, INC. |
发明人 |
BAJAJ Rajeev |
| 分类号 |
B24B53/017 |
主分类号 |
B24B53/017 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A CMP system comprising a polishing table for supporting a CMP pad on which a semiconductor wafer is polished, wherein the improvement comprises:
a laser source configured to regenerate the CMP pad through a conditioning process while the CMP pad is disposed on the polishing table. |
| 地址 |
Santa Clara CA US |
