PACKAGE SUBSTRATE UNIT AND PREPARATION METHOD THEREFOR, AND SUBSTRATE ASSEMBLY

摘要

A method for preparing a package substrate unit comprises: preparing a multi-layer substrate, and designing more than one package substrate unit on the multi-layer substrate; treating a shielding groove on the periphery of each package substrate unit; metalizing a sidewall of the shielding groove; removing an outer copper foil of a central region of the package substrate unit; and on the central region with the outer copper foil removed, treating an accommodating groove used for fixing an electronic element. The embodiments of the present invention also provide a corresponding package substrate unit and a substrate assembly. In the technical solutions of the present invention, a shielding groove is treated on the periphery of a package substrate unit and a sidewall of the shielding groove is metalized as a metal shielding layer; in this manner, electromagnetic shielding is simply and reliably implemented on an electronic device and an additional shielding case is not required, which does not increase the thickness of a package substrate and does not decrease the universality of a product, the structure is reliable, the incapacitation risk is lowered, and the cost is low.