Semiconductor power module and method for manufacturing the same

摘要

A one power semiconductor module, with the first housing part forming structure unit and the direct current voltage of a connecting device, the first housing part having a recess, a direct current voltage connecting device has a first and a second direct current voltage a connecting element, the first direct current voltage connecting element is provided with a first punch segment in a recess, second direct current voltage connecting element is provided with a second punch the recess in a, construction there is a gap between the first and second punch segments, first and second through section to the elastomer, elastomer fill gap, elastic body and first and second section material through a locking manner so that the first and second punch segment relative to the first housing part seal. A direct current loading connecting element reliably and has a high temperature change tolerance relative to the housing to seal a power semiconductor module, a direct current voltage a connecting element between a pitch can be small floor.