发明名称 Dielectrophoretic restriction to prevent vapor backflow
摘要 A cooling system has an inlet plenum and at least one cooling channel which communicates with the inlet plenum. The cooling channel passes adjacent to a component to be cooled from an upstream inlet to a downstream outlet. A pair of electrodes are positioned adjacent the inlet to create an electric field tending to resist a bubble formed in an included dielectric liquid from moving in an upstream direction due to a dielectrophoretic force. Instead, a dielectrophoretic force urges the bubble in a downstream direction.
申请公布号 US8848371(B2) 申请公布日期 2014.09.30
申请号 US201213632332 申请日期 2012.10.01
申请人 Hamilton Sundstrand Corporation 发明人 Pearson Matthew Robert
分类号 F04B19/00;H05K7/20;G06F1/20;G06F19/00;F28D15/00 主分类号 F04B19/00
代理机构 Carlson, Gaskey & Olds, PC 代理人 Carlson, Gaskey & Olds, PC
主权项 1. A dielectrophoretic cooling system comprising: an inlet plenum and at least one cooling channel communicating with said inlet plenum, said at least one cooling channel passing adjacent to a component to be cooled, from an upstream inlet to a downstream outlet, and a pair of electrodes positioned adjacent one of said inlet and said outlet, said electrodes being provided to create an electric field tending to urge a bubble formed in an included dielectric liquid to move in a downstream direction.
地址 Windsor Locks CT US