发明名称 |
Dielectrophoretic restriction to prevent vapor backflow |
摘要 |
A cooling system has an inlet plenum and at least one cooling channel which communicates with the inlet plenum. The cooling channel passes adjacent to a component to be cooled from an upstream inlet to a downstream outlet. A pair of electrodes are positioned adjacent the inlet to create an electric field tending to resist a bubble formed in an included dielectric liquid from moving in an upstream direction due to a dielectrophoretic force. Instead, a dielectrophoretic force urges the bubble in a downstream direction. |
申请公布号 |
US8848371(B2) |
申请公布日期 |
2014.09.30 |
申请号 |
US201213632332 |
申请日期 |
2012.10.01 |
申请人 |
Hamilton Sundstrand Corporation |
发明人 |
Pearson Matthew Robert |
分类号 |
F04B19/00;H05K7/20;G06F1/20;G06F19/00;F28D15/00 |
主分类号 |
F04B19/00 |
代理机构 |
Carlson, Gaskey & Olds, PC |
代理人 |
Carlson, Gaskey & Olds, PC |
主权项 |
1. A dielectrophoretic cooling system comprising:
an inlet plenum and at least one cooling channel communicating with said inlet plenum, said at least one cooling channel passing adjacent to a component to be cooled, from an upstream inlet to a downstream outlet, and a pair of electrodes positioned adjacent one of said inlet and said outlet, said electrodes being provided to create an electric field tending to urge a bubble formed in an included dielectric liquid to move in a downstream direction. |
地址 |
Windsor Locks CT US |