HIGH-HEAT-CONDUCTION PLATE MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a high-heat-conduction plate which has mechanical strength allowing use as e.g. an element mounting plate also serving as a thermal diffusion plate for element cooling and does not cause problems related to liquid impregnation during wet treatment or deterioration of thermal conductivity.SOLUTION: A plate-like high-heat-conduction base material 10 consisting of an aluminum powder sintered body containing a carbon-based material is wrapped with a thin skin-like shell 20. The shell 20 consists of first skin layers 21 joined with both surfaces of the high-heat-conduction base material 10 and second skin layers 22 joined with the whole of side surfaces of the high-heat-conduction base material 10 and is composed of an aluminum powder sintered body, a bulk body of aluminum or their combination.