发明名称 INJECTION MOLD FOR INNER COVER MEMBER OF ELECTRONIC DEVICE AND METHOD FOR FORMING INNER COVER MEMBER USING THE SAME
摘要 Disclosed are an injection mold for an inner cover member for insert injection molding of an inner cover member of an electronic device case including multiple parts with different required properties, and a method for forming an inner cover member using the same. The disclosed injection mold for an inner cover member forms a product by inserting a transparent window into a cavity formed by contacting an upper core and a lower core and injecting a molten resin. The transparent window comprises a center part, and an outer circumferential part which is thinner than the thickness of the center part and is protruded from the outer circumference of the center part to be more protruded than the upper side and the lower side of the center part. A lower installation groove in which the center part of the transparent window and a lower shape limiting groove liming the lower shape of a part of the inner cover member except for the center part are formed on the upper side of the lower core of the injection mold for an inner cover member. When the center part is installed on the lower installation groove, the outer circumferential part invades a region of the lower shape liming groove, and a gap for the molten resin to be flowed in is formed between the bottom of the lower shape limiting groove and the outer circumferential part.
申请公布号 KR101444087(B1) 申请公布日期 2014.09.26
申请号 KR20130135140 申请日期 2013.11.08
申请人 JAEYOUNG SOLUTEC CO., LTD. 发明人 KIM, HAK KWON;KIM, SEUNG JAE;KIM, DAE JIN;CHOI, MIN HWAN
分类号 B29C45/14;B29C45/17 主分类号 B29C45/14
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