发明名称 |
ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT PACKAGE |
摘要 |
An electronic component includes a laminated capacitor and a substrate-type terminal including a substrate main body, first and second component connection electrodes, first and second external connection electrodes, and first and second connection electrodes. The substrate main body is made of a material and has a thickness that significantly reduces or prevents vibration being transmitted to a circuit substrate on which it is mounted. |
申请公布号 |
US2014284089(A1) |
申请公布日期 |
2014.09.25 |
申请号 |
US201414198610 |
申请日期 |
2014.03.06 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
HATTORI Kazuo;FUJIMOTO Isamu;FUJIDAI Masanori |
分类号 |
H05K1/02;H05K1/18 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
1. An electronic component, comprising:
a laminated capacitor including a plurality of dielectric layers and a plurality of internal electrodes defining a laminate, and a first external electrode and a second external electrode electrically connected to the internal electrodes and located on both end surfaces of the laminate in a longitudinal direction, respectively; and a substrate-type terminal including an insulating substrate main body, a first component connection electrode located on a first main surface of the substrate main body on which the laminated capacitor is arranged, and connected to the first external electrode, a second component connection electrode located on the first main surface of the substrate main body and connected to the second external electrode, a first external connection electrode located on a second main surface of the substrate main body opposite to the first main surface, a second external connection electrode located on the second main surface of the substrate main body, a first connection electrode connecting the first component connection electrode and the first external connection electrode, and a second connection electrode connecting the second component connection electrode and the second external connection electrode; wherein the substrate main body includes an inorganic material; the substrate main body has a thickness of more than or equal to about 0.05 mm and less than or equal to about 0.4 mm; and the substrate main body has a Young's modulus of more than or equal to about 100 GPa and less than or equal to about 400 GPa. |
地址 |
Nagaokakyo-shi JP |