RESIN COMPOSITION, HEAT-CONDUCTIVE ADHESIVE, AND SEMICONDUCTOR MODULE

摘要

PROBLEM TO BE SOLVED: To provide a heat-conductive resin composition having a favorable flexibility and capable of sustaining a high adhesiveness and a high heat conductivity even at an ultrahigh temperature of 200°C or above; a heat-conductive adhesive including the resin composition; and a semiconductor module including the heat-conductive adhesive.SOLUTION: The provided resin composition includes an epoxy compound (A) expressed by the following general formula (1): (1), an epoxy compound (B) expressed by the following general formula (2): (2), a curative (C), and a heat-conductive filler (D); a heat-conductive adhesive including the resin composition and a semiconductor module including the heat-conductive adhesive are also provided.