| 摘要 |
The invention relates to a stereo camera module (1) which comprises a first image sensor and a second image sensor, a support (4) having mounting surfaces (4.1, 4.2) oriented substantially in the same plane and for arrangement of said first and second image sensors (2.1, 2.2) on these mounting surfaces (4.1, 4.2), a first lens housing (5.1) arranged on the support (4) and having an optical system (6.1) for the first image sensor (2.1), a second lens housing (5.2) arranged on the support (4) and having an optical system (6.2) for the second image sensor (2.2), and a printed circuit board arrangement (7) for electrically contacting the first and the second image sensors through the support (4). According to the invention, the first and second image sensors are each in the form of an image sensor chip (2.1, 2.2) having wire bond connections (3.1, 3.2) and the printed circuit board arrangement (7) has wire bond surfaces (8) for contacting the wire bond connections (3.1, 3.2) of the first and second image sensor chips (2.1, 2.2). |
