| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a module that has high reliability of connection with the outside.SOLUTION: A module 1 includes: a circuit board 2; a resin layer 4a that is provided for one principal surface of the circuit board 2; an external connection conductor 6 that is arranged in the resin layer 4a, whose one end is connected to the circuit board 2, and whose other end protrudes from a surface of the resin layer 4a, with a part of the external connection conductor 6, which protrudes from the surface of the resin layer 4a, including a projection part extending along the surface of the resin layer 4a; and a solder bump 7 that is formed on the other end side of the external connection conductor 6. With this construction, it is possible to, when a stress is applied under a situation where the module 1 is connected to the outside, displace a connection interface between the external connection conductor 6 and the solder bump 7, whose mechanical strength is low, from a part where the stress concentrates, which improves reliability of connection between the module 1 and the outside.</p> |
