SEALING SHEET FOR SEMICONDUCTOR ELEMENTS, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide: a sealing sheet for semiconductor elements which makes possible to manufacture a semiconductor device arranged so that a piece of information given by marking can be visually recognized well; and a manufacturing method thereof.SOLUTION: A sealing sheet for semiconductor elements comprises: a mold releasing film having a surface put in a condition in which the surface smoothness (Ra) is 0.1-0.5μm, and the average distance (RSm) between asperities is 90-125μm; and a sealing material layer disposed on the mold releasing film.