| 摘要 |
PROBLEM TO BE SOLVED: To improve precipitation property of a metallic material inside a hole formed in a circuit board.SOLUTION: In a production method of an interposer board as one embodiment of this invention, there is prepared a circuit board having a first face and a second face, and with a through hole that penetrates the first face and the second face or with a closed-end hole in the second face. A seed layer is arranged on the circuit board. Through performing an electrolytic plating method in which electricity is supplied to the seed layer under a state where the circuit board with the seed layer formed is made to contact with a plating solution, a metallic material is filled inside the through hole or the closed-end hole. The plating solution includes a tin ion and an ion of a metal to be precipitated. |
