| 摘要 |
PROBLEM TO BE SOLVED: To provide a base for mounting a light-emitting element, a light-emitting device provided with the same, or a lead frame which easily prevents leakage of a sealing resin component and infiltration of a solder flux.SOLUTION: A base for mounting a light-emitting element includes: a lead electrode (10) having a first main surface (10a), a second main surface (10b) on the side opposite to the first main surface, and one end surface including a first concave surface region (10ca) continued to the first main surface and a second concave surface region (10cb) continued to the second main surface; and a resin-molded body (20) which exposes at least a part of the first main surface and at least a part of the second main surface, covers at least a part of the one end surface, and is molded integrally with the lead electrode, in a cross-sectional view. The second concave surface region (10cb) includes a closest portion (P) which is closest to the first main surface (10a), and an extension portion (10cbe) which is outside than the closest portion and extends to the side of the second main surface (10b). The first concave surface region (10ca) is provided outside than the closest portion (P) of the second concave region. |
