发明名称 CONJUGATE, SUBSTRATE FOR POWER MODULE, AND SUBSTRATE FOR POWER MODULE WITH HEAT SINK
摘要 <p>PROBLEM TO BE SOLVED: To provide a conjugate in which an aluminum member and a metallic component comprising one of copper, nickel, and silver are favorably jointed, and when a heat cycle is loaded, a generation of a crack in a junction can be suppressed, and joint reliability is favorable; a substrate for a power module; and the substrate for a power module with a heat sink.SOLUTION: At a junction between an aluminum member and a metallic component, a Ti layer 15 that locates at a side of the metallic component and an Al-Ti-Si layer that locates between the Ti layer and the aluminum member in which Si performs solid solution in AlTi are formed, and the Al-Ti-Si layer includes: a first Al-Ti-Si layer that is formed at a side of the Ti layer; and a second Al-Ti-Si layer with an Si concentration lower than that of the first Al-Ti-Si layer that is formed at a side of the aluminum member.</p>
申请公布号 JP2014177031(A) 申请公布日期 2014.09.25
申请号 JP20130052408 申请日期 2013.03.14
申请人 MITSUBISHI MATERIALS CORP 发明人 TERASAKI NOBUYUKI;NAGATOMO YOSHIYUKI
分类号 B32B15/01;B23K20/00;H01L23/12;H01L23/36 主分类号 B32B15/01
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