发明名称 |
LIGHT EMITTING DIODE (LED) PACKAGES AND RELATED METHODS |
摘要 |
<p>Light emitting diode (LED) packages and methods are disclosed herein. In one aspect, a light emitting package is disclosed. The light emitting package includes one or more areas of conductive material having a thickness of less than approximately 50 microns (mum). The package can further include at least one light emitting diode (LED) electrically connected to the conductive material and at least one thin gap disposed between areas of conductive material.</p> |
申请公布号 |
EP2780955(A1) |
申请公布日期 |
2014.09.24 |
申请号 |
EP20120849022 |
申请日期 |
2012.11.14 |
申请人 |
CREE, INC. |
发明人 |
ANDREWS, PETER, SCOTT;BRITT, JEFFREY, CARL |
分类号 |
H01L33/62;H01L23/373;H01L25/075;H01L33/48;H01L33/60;H01L33/64;H05K1/03;H05K3/40 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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