发明名称 |
Semiconductor interconnect structure having enhanced performance and reliability |
摘要 |
An interconnect structure and method for fabricating the interconnect structure having enhanced performance and reliability, by minimizing oxygen intrusion into a seed layer and an electroplated copper layer of the interconnect structure, are disclosed. At least one opening in a dielectric layer is formed. A sacrificial oxidation layer disposed on the dielectric layer is formed. The sacrificial oxidation layer minimizes oxygen intrusion into the seed layer and the electroplated copper layer of the interconnect structure. A barrier metal layer disposed on the sacrificial oxidation layer is formed. A seed layer disposed on the barrier metal layer is formed. An electroplated copper layer disposed on the seed layer is formed. A planarized surface is formed, wherein a portion of the sacrificial oxidation layer, the barrier metal layer, the seed layer, and the electroplated copper layer are removed. In addition, a capping layer disposed on the planarized surface is formed. |
申请公布号 |
US8841770(B2) |
申请公布日期 |
2014.09.23 |
申请号 |
US201314080160 |
申请日期 |
2013.11.14 |
申请人 |
International Business Machines Corporation |
发明人 |
Cabral, Jr. Cyril;Dubois Geraud J. M.;Edelstein Daniel C.;Nogami Takeshi;Sanders Daniel P. |
分类号 |
H01L23/48;H01L23/532;H01L21/768;H01L23/522 |
主分类号 |
H01L23/48 |
代理机构 |
|
代理人 |
Cadmus Nicholas L. |
主权项 |
1. An interconnect structure comprising:
at least one opening in a dielectric layer; a sacrificial oxidation layer disposed in the opening; a barrier metal layer disposed on the sacrificial oxidation layer; a seed layer disposed on the barrier metal layer, wherein the seed layer comprises copper and impurities, and wherein the impurities include manganese, aluminum, tin, or a combination thereof; an electroplated copper layer disposed on the seed layer; and a capping layer disposed over the dielectric layer and the electroplated copper layer. |
地址 |
Armonk NY US |