| 摘要 |
PROBLEM TO BE SOLVED: To provide ceiling plates which are reduced in manufacturing costs without thickening plate thicknesses of the ceiling plates by processing the warpage of the ceiling plates caused by moisture absorption while making the warpage visually inconspicuous, and a ceiling grid system.SOLUTION: Ceiling plates 1 are arranged at a ceiling face 7, and a plurality of bars 6 which are ground in single directions are formed at decorative faces 2 of the ceiling plates 1, or the adjacent ceiling plates 1 are pasted so that directions in which the bars 6 are formed intersect with one another, or pasted so that a ceiling face 7 body exhibits a checker pattern by the formed bars 6. A ceiling grid system 10 using the ceiling plate 1 is constituted of a plurality of the ceiling plates 1 which are pasted by grids (g), ceiling backing materials 11 which are arranged at respective pitches (p), hanging hooks 12 arranged in vicinities of cross points of the pitches (p), and hanging bolts 13 for hanging the hanging hooks from a floor slab 15. The ceiling plates 1 are attached to the ceiling backing materials while the bars 6 have directionality. |
