| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide film which has high heat resistance and high transparency and achieves both a low heat linear expansion coefficient and low Rth.SOLUTION: There is provided a polyimide film prepared by imidization of a polyamic acid varnish, wherein the polyamic acid varnish contains a diamine compound, a tetracarboxylic acid dianhydride and a metal alkoxide in an organic solvent and a polyamide film can be obtained by imidization of a sol-gel reaction product by addition of water. The film can be widely used as a film, a coating agent, a molded component and an insulating material in a field such as electric, electronic, automotive and aerospace industry. |
