| 发明名称 |
METHODS FOR BONDING A HERMETIC MODULE TO AN ELECTRODE ARRAY |
| 摘要 |
A method for bonding a hermetic module to an electrode array including the steps of: providing the electrode array having a flexible substrate with a top surface and a bottom surface and including a plurality of pads in the top surface of the substrate; attaching the hermetic module to the bottom surface of the electrode array, the hermetic module having a plurality of bond-pads wherein each bond-pad is adjacent to the bottom surface of the electrode array and aligns with a respective pad; drill holes through each pad to the corresponding bond-pad; filling each hole with biocompatible conductive ink; forming a rivet on the biocompatible conductive ink over each pad; and overmolding the electrode array with a moisture barrier material. |
| 申请公布号 |
US2014273345(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
US201313836582 |
申请日期 |
2013.03.15 |
| 申请人 |
The Charles Stark Draper Laboratory, Inc. |
发明人 |
Sriram Tirunelveli;Smith Brian;Mclaughlin Bryan;Lachapelle John |
| 分类号 |
H01L23/00;H01L25/065 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for bonding a hermetic module to an electrode array comprising the steps of:
providing the electrode array having a flexible substrate with a top surface and a bottom surface and including a plurality of pads in the top surface of the substrate; attaching the hermetic module to the bottom surface of the electrode array, the hermetic module having a plurality of bond-pads wherein each bond-pad is adjacent to the bottom surface of the electrode array and aligns with a respective pad; drill holes through each pad to the corresponding bond-pad; filling each hole with biocompatible conductive ink; forming a rivet on the biocompatible conductive ink over each pad; and overmolding the electrode array with a moisture barrier material. |
| 地址 |
US |
