| 发明名称 |
METHOD OF SEPARATING AN ATOMICALLY THIN MATERIAL FROM A SUBSTRATE |
| 摘要 |
A method of separating an atomically thin material, such as graphene, from a substrate, such as copper, is disclosed. The method provides a composite sheet, such as a graphene-copper sheet, and then applies hypersonic waves to the composite sheet so as to break the bonds therebetween and separate a graphene sheet from the copper substrate. A system to implement the separation is also disclosed. |
| 申请公布号 |
US2014261999(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
US201414203676 |
申请日期 |
2014.03.11 |
| 申请人 |
LOCKHEED MARTIN CORPORATION |
发明人 |
Stetson, JR. John B.;Stetson James B.;Viss Stanley J. |
| 分类号 |
B32B43/00;C01B31/04 |
主分类号 |
B32B43/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of separating a composite sheet which includes an atomically thin material and a substrate, comprising:
applying hypersonic waves to the composite sheet so as to separate the atomically thin material from the substrate. |
| 地址 |
BETHESDA MD US |
