| 发明名称 |
REMOVING MATERIAL FROM A WORKPIECE WITH A WATER JET |
| 摘要 |
A method is provided for removing material from a workpiece using a material removal device and a measurement device. The method includes measuring a first dimension of the workpiece at a location with the measurement device. A jet of water is directed from the material removal device to the location to remove material from the workpiece at the location. A second dimension of the workpiece at the location is measured with the measurement device. The first dimension is compared to the second dimension to determine a measured thickness of the material removed from the workpiece at the location. |
| 申请公布号 |
US2014273747(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
US201414212126 |
申请日期 |
2014.03.14 |
| 申请人 |
United Technologies Corporation |
发明人 |
Markowski John E.;Ruglio Anthony G.;Patel Dipakkumar S.;Lockyer Keith E. |
| 分类号 |
B24C1/04;G01B11/06 |
主分类号 |
B24C1/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for removing material from a workpiece using a material removal device and a laser measurement device, the method comprising:
measuring a first dimension of the workpiece at a location with the laser measurement device; directing a jet of water from the material removal device to the location to remove material from the workpiece at the location; measuring a second dimension of the workpiece at the location with the laser measurement device; and comparing the first dimension to the second dimension to determine a measured thickness of the material removed from the workpiece at the location. |
| 地址 |
Hartford CT US |
