SEMICONDUCTOR DEVICE

摘要

A device includes a semiconductor substrate, a first penetrating electrode penetrating through the semiconductor substrate, a first test pad, and a first tri-state buffer coupled between the first penetrating electrode and the first test pad. The first tri-state buffer receives a buffer control signal at a control terminal thereof. The device further includes a buffer control circuit supplying the buffer control signal to the first tri-state buffer.

主权项

1. A semiconductor device comprising:
a semiconductor substrate; a plurality of electrodes extending from a front side of the semiconductor substrate to an opposite side of the semiconductor substrate; a plurality of pads on the front side of the semiconductor substrate; a plurality of tri-state buffers coupled between respective ones of the plurality of electrodes and respective ones of the plurality of pads; a first input pad on the front side of the semiconductor substrate configured to receive a first input signal; and a buffer controller configured to receive the first input signal and to provide a buffer control signal to the plurality of tri-state buffers, wherein the buffer control signal is configured to activate the plurality of tri-state buffers to electrically connect respective ones of the plurality of electrodes with respective ones of the plurality of pads during a time in which the first input signal has an active level.