Method for Forming ReRAM Chips Operating at Low Operating Temperatures

摘要

Forming a resistive memory structure at a temperature well above the operating temperature can reduce the forming voltage and create a defect distribution with higher stability and lower programming voltages. The forming temperature can be up to 200 C above the operating temperature. The memory chip can include an embedded heater in the chip package, allowing for a chip forming process after packaging.

主权项

1. A method to prepare a memory device, comprising forming a switching element of the memory device at a forming temperature higher than an operating temperature of the memory device.