| 发明名称 |
WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF |
| 摘要 |
Disclosed is a wiring substrate and method of manufacturing thereof, the wiring substrate including: a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a connection terminal extended from the substrate and bending in a direction that is perpendicular to a surface of the substrate; and a heat radiation piece section integrally installed to the connection terminal. |
| 申请公布号 |
US2014268581(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
US201414289335 |
申请日期 |
2014.05.28 |
| 申请人 |
YAZAKI CORPORATION |
发明人 |
HARAO Akira;MATSUNAGA Mototatsu;SUGIURA Yasuhiro;KUBOTA Minoru |
| 分类号 |
H05K1/02 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A wiring substrate, comprising:
a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a connection terminal extended from the substrate and bending in a direction that is perpendicular to a surface of the substrate; and a heat radiation piece section integrally installed to the connection terminal. |
| 地址 |
Tokyo JP |
