| 发明名称 |
CAPACITOR WITH A DIELECTRIC BETWEEN A VIA AND A PLATE OF THE CAPACITOR |
| 摘要 |
In a particular embodiment, a device includes a substrate, a via that extends at least partially through the substrate, and a capacitor. A dielectric of the capacitor is located between the via and a plate of the capacitor, and the plate of the capacitor is external to the substrate and within the device. |
| 申请公布号 |
US2014268616(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
US201313833632 |
申请日期 |
2013.03.15 |
| 申请人 |
QUALCOMM INCORPORATED |
发明人 |
Lan Je-Hsiung;Zuo Chengjie;Yun Changhan;Berdy David F.;Kim Daeik D.;Mikulka Robert P.;Velez Mario Francisco;Kim Jonghae |
| 分类号 |
H01L49/02;G06F17/50 |
主分类号 |
H01L49/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A device comprising:
a substrate; a via that extends at least partially through the substrate; and a capacitor, wherein a dielectric of the capacitor is located between the via and a plate of the capacitor and wherein the plate of the capacitor is external to the substrate and within the device. |
| 地址 |
San Diego CA US |
