Nonvolatile semiconductor memory device and method of manufacturing the same

摘要

A nonvolatile semiconductor memory device including a memory cell configured to store data and a resistor element provided around the memory cell. The memory cell includes a charge storage layer provided above a substrate, a first semiconductor layer formed on a top surface of the charge storage layer via an insulating layer, and a first low resistive layer formed on a top surface of the first semiconductor layer and having resistance lower than that of the first semiconductor layer. The resistor element includes a second semiconductor layer formed on the same layer as the first semiconductor layer, and a second low resistive layer formed on the same layer as the first low resistive layer and on a top surface of the second semiconductor layer, having resistance lower than that of the second semiconductor layer.

主权项

1. A nonvolatile semiconductor memory device comprising:
a memory cell; and a resistor element provided around the memory cell, the memory cell including: a charge storage layer provided above a substrate; a first semiconductor layer formed on a top surface of the charge storage layer via an insulating layer, the first semiconductor layer having a plain top surface; and a first low resistive layer formed on a top surface of the first semiconductor layer and having a resistance lower than that of the first semiconductor layer, the resistor element includes: a second semiconductor layer formed in the same layer as the first semiconductor layer, the second semiconductor having a plain top surface with the same height as the plain top surface of the first semiconductor layer; and a second low resistive layer formed in the same layer as the first low resistive layer and on a top surface of the second semiconductor layer, the second semiconductor layer being formed to extend in a first direction parallel to the substrate, and the second low resistive layer being formed at both ends of the second semiconductor layer, and wherein: the resistor element includes an interlayer insulation layer formed on the substrate, a surface of the interlayer insulation layer having the same height as a surface of the insulating layer; and the second semiconductor layer is formed directly on the interlayer insulation layer.