| 发明名称 |
Method of fabricating a package substrate |
| 摘要 |
A method of fabricating a package substrate including preparing a substrate having at least one conductive pad, forming an insulating layer having an opening to expose the conductive pad on the substrate, forming a separation barrier layer on the conductive pad inside the opening to be higher than the upper surface of the insulating layer along the side walls thereof, forming a post terminal on the separation barrier layer, and forming a solder bump on the post terminal. |
| 申请公布号 |
US8835302(B2) |
申请公布日期 |
2014.09.16 |
| 申请号 |
US201313866464 |
申请日期 |
2013.04.19 |
| 申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
Lee Dong Gyu;Lee Dae Young;Chung Tae Joon;Mun Seon Jae;Choi Jin Won |
| 分类号 |
H01L23/495;H01L21/48;H01L21/441;H01L23/485 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of fabricating a package substrate, the method comprising:
preparing a substrate having at least one conductive pad; forming an insulating layer having an opening to expose the conductive pad on the substrate; forming a plating seed layer on the insulating layer; forming a dry film pattern on the plating seed layer in order to form a separation barrier layer; forming the separation barrier layer on the conductive pad inside the opening to be higher than the upper surface of the insulating layer along the side walls thereof; forming a post terminal on the separation barrier layer; and forming a solder bump on the post terminal. |
| 地址 |
Suwon KR |
