发明名称 |
Light-emitting device including LED element whose upper surface is free from white resin and method of manufacturing the same |
摘要 |
A light-emitting device includes a substrate that includes at least a pair of electrodes, an LED element electrically mounted on the substrate, a phosphor plate adhered to an upper surface of the LED element and including an upper surface and a lower surface each having an area larger than that of the upper surface of the LED element, a white resin provided on an upper surface of the substrate and seamlessly covering a peripheral side surface of the LED element and a peripheral side surface of the phosphor plate. A lower surface of the phosphor plate is adhered to the upper surface of the LED element through a transparent adhesive. |
申请公布号 |
US8836208(B2) |
申请公布日期 |
2014.09.16 |
申请号 |
US201213525934 |
申请日期 |
2012.06.18 |
申请人 |
Citizen Electronics Co., Ltd.;Citizen Holdings Co., Ltd. |
发明人 |
Kazuya Ishihara;Suto Yuki;Watanabe Yusuke |
分类号 |
H01J1/62;H01J9/00 |
主分类号 |
H01J1/62 |
代理机构 |
Browdy and Neimark, PLLC |
代理人 |
Browdy and Neimark, PLLC |
主权项 |
1. A method producing a light-emitting device comprising:
electrically mounting a light-emitting diode element on a pair of electrodes that are included in a substrate; adhering a lower surface of a phosphor plate that is larger than an upper surface of the light-emitting diode element, to the upper surface of the light-emitting element through a transparent adhesive; disposing a frame that includes a step portion with a first upper surface and a second upper surface provided at an upper portion of the frame, on an upper surface of the substrate to surround a peripheral side surface of the light-emitting diode element and a peripheral side surface of the phosphor plate provided on the upper surface of the light-emitting diode element; disposing a white resin in the frame. |
地址 |
Yamanashi-Ken JP |