发明名称 Light emitting device package and lighting system
摘要 Disclosed are a light emitting device package and a lighting system. The light emitting device package includes a body including a cavity and formed in a transmittive material; a plurality of lead electrodes in the cavity; an isolation member disposed between the lead electrodes; a light emitting device electrically connected to the lead electrodes in the cavity; and a molding member on the light emitting device.
申请公布号 US8835969(B2) 申请公布日期 2014.09.16
申请号 US201314013882 申请日期 2013.08.29
申请人 LG Innotek Co., Ltd. 发明人 Jang Ji Won
分类号 H01L33/58 主分类号 H01L33/58
代理机构 KED & Associates LLP 代理人 KED & Associates LLP
主权项 1. A light emitting device package comprising: a plurality of lead electrodes; a body on a top surfaces of the plurality of lead electrodes; a cavity in the body; an isolation member disposed between the plurality of lead electrodes; a light emitting device disposed in the cavity and electrically connected to the plurality of lead electrodes; a molding member in the cavity; and a lens member over the body, wherein the body includes a light-transmittive material, wherein the isolation member includes a material different from the light-transmittive material of the body, wherein the isolation member includes the material having reflectance higher than that of the body, wherein the lens member includes plurality of support parts located at an outer position and lateral sides of the body.
地址 Seoul KR