Method and device for the plasma treatment of running metal substrates

摘要

The invention relates to a method and a device for the plasma treatment of metal substrates or insulating substrates (3) running substantially continuously through a vacuum chamber having a treatment zone (2), the plasma being sustained by radiofrequency inductive coupling in the treatment zone (2) by means of an inductor (4) connected to a radiofrequency generator, in which the inductor (4) is protected from any contamination by the material emitted by the surface of the substrates (3) by means of a Faraday cage (7), which is positioned between the plasma and the inductor (4), and in which the Faraday cage (7) is on average electrically biassed positively with respect to the substrates (3) or with respect to a counter-electrode present in the plasma.

主权项

1. A method for the plasma treatment of metal or insulating substrates, said method comprising:
passing at least one substrate substantially continuously through a vacuum chamber having a treatment area (2), the at least one substrate passing through said treatment area (2); maintaining the plasma by radio-frequency inductive coupling in the treatment area (2) by means of an inductor (4) connected to a radio-frequency generator; protecting the inductor (4) from any contamination by the material emitted by the surface of the substrate (3) by positioning a Faraday screen (7) between the plasma and the inductor (4) and directly adjacent to the plasma, wherein the Faraday screen (7) constitutes a conductive electrode; electrically polarizing the Faraday screen (7) on average positively with respect to the substrate (3), thereby accelerating ions present in the plasma towards the substrate (3); generating the plasma between the Faraday screen and the substrates in the treatment area; and recovering electrons from the plasma at the electrode forming the Faraday screen (7), the plasma being generated between the Faraday screen and the substrates in the treatment area.