Electronic device packages including bump buffer spring pads and methods of manufacturing the same

摘要

Electronic device packages and related methods are provided. The electronic device package includes a first substrate having a first contact portion disposed thereon, a bump having a first contact surface connected to the first contact portion and a second contact surface disposed opposite to the first contact surface, and a buffer spring pad portion between the first contact portion of the first substrate and the first contact surface of the bump. The buffer spring pad portion includes at least two different conductive material layers which are stacked.

主权项

1. An electronic device package comprising:
a first substrate having a first contact portion disposed thereon; a second substrate having a second contact portion opposite to the first contact portion; a first dielectric layer disposed on the first substrate to have a first window exposing the first contact portion; a buffer spring pad portion covering the exposed surface portion of the first contact portion; and a bump protruding from a surface of the first dielectric layer to the second substrate, the bump has a first contact surface covering the buffer spring pad portion to be electrically connected to the first contact portion and a second contact surface disposed opposite to the first contact surface to be electrically connected to the second contact portion; wherein the buffer spring pad portion includes at least two different conductive material layers which overlap each other.