Multilayered semiconductor device, printed circuit board, and method of manufacturing multilayered semiconductor device

摘要

Provided is a multilayered semiconductor device, including: a first semiconductor package including a first semiconductor element and a first wiring board; a second semiconductor package including: a second semiconductor element, a second wiring board and a first encapsulating resin for encapsulating the second semiconductor element therein; and a plate member disposed between the first semiconductor package and the second semiconductor package, the first semiconductor package, the plate member, and the second semiconductor package being stacked in this order, in which the first wiring board and the second wiring board are electrically connected to each other via a metal wire through one of a notch and an opening formed in the plate member and the first semiconductor element, the second semiconductor package, and the metal wire are encapsulated in a second encapsulating resin.

主权项

1. A multilayered semiconductor device, comprising:
a first semiconductor package, comprising:
a first semiconductor element; anda first wiring board having the first semiconductor element mounted on one surface thereof and having a plurality of connection pads for electric connection to an outside formed on another surface thereof; a second semiconductor package, comprising:
a second semiconductor element;a second wiring board having the second semiconductor element mounted on one surface thereof; anda first encapsulating resin for encapsulating the second semiconductor element therein; and a plate member disposed between the first semiconductor package and the second semiconductor package, wherein: the first semiconductor package, the plate member, and the second semiconductor package are stacked in this order; the first wiring board and the second wiring board are electrically connected to each other via a metal wire through one of a notch and an opening formed in the plate member; and the first semiconductor element, the second semiconductor package, and the metal wire are encapsulated in a second encapsulating resin.