发明名称 CHIP ON FLEX OPTICAL SUBASSEMBLY
摘要 One example embodiment includes an optical subassembly (OSA). The OSA includes a flex circuit, an optical port, and an active optical component subassembly. The flex circuit is constructed of at least one electrically-conductive layer and at least one electrical insulator layer. The optical port defines a barrel cavity and is mechanically coupled to the flex circuit at a flex connection. The active optical component subassembly is positioned within the barrel cavity and electrically coupled to the flex circuit.
申请公布号 KR20140109423(A) 申请公布日期 2014.09.15
申请号 KR20147018929 申请日期 2012.12.14
申请人 FINISAR CORPORATION 发明人 STAPLETON BRENT;DWIVEDI RAJEEV;WALKER JR. HAROLD YOUNG;LANDRY GARY
分类号 G02B6/43 主分类号 G02B6/43
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