METHOD AND APPARATUS FOR PROTECTING A SUBSTRATE DURING PROCESSING BY A PARTICLE BEAM

摘要

The invention refers to a method and apparatus for protecting a substrate during a processing by at least one particle beam. The method comprises the following steps: (a) applying a locally restrict limited protection layer on the substrate; (b) etching the substrate and/or a layer arranged on the substrate by use of the at least one particle beam and at least one gas; and/or (c) depositing material onto the substrate by use of the at least one particle beam and at least one precursor gas; and (d) removing the locally limited protection layer from the substrate.

主权项

1. A method for protecting a substrate during a processing by at least one particle beam, the method comprising the following steps:
a. applying a locally limited protection layer on the substrate; b. etching the substrate and/or a layer arranged on the substrate by the at least one particle beam and at least one gas; and/or c. depositing material onto the substrate by use of the at least one particle beam and at least one precursor gas; and d. removing the locally limited protection layer from the substrate.