Surface Treatment Method and Apparatus for Semiconductor Packaging

摘要

A surface treatment and an apparatus for semiconductor packaging are provided. In an embodiment, a surface of a conductive layer is treated to create a roughened surface. In one example, nanowires are formed on a surface of the conductive layer. In the case of a copper conductive layer, the nanowires may include a CuO layer. In another example, a complex compound is formed on a surface of the conductive layer. The complex compound may be formed using, for example, thiol and trimethyl phosphite.

主权项

1. A method of forming a semiconductor device, the method comprising:
providing a substrate having an integrated circuit die attached thereto, the substrate having a metal layer formed thereon; treating exposed surfaces of the metal layer, the treating creating a roughened surface having nanowires; and applying a molding compound or a underfill material over the metal layer.