CAMERA MODULE

摘要

A camera module, in which a recessed portion that has a greater depth than the thickness of an imaging device is disposed on the surface (top surface) of an embedded-component substrate. An imaging device is bonded to a bottom of the recessed portion such that an opening is present between the surface (top surface) of the imaging device and the surface (top surface) of the embedded-component substrate. Connection pads on the imaging device are connected to conductor pads disposed on the surface (top surface) of the embedded-component substrate by bonding wires that go through the opening.

主权项

1. A camera module, comprising:
an embedded-component substrate having electronic components embedded therein; an imaging device bonded to the embedded-component substrate; and lenses disposed above the imaging device, wherein a recessed portion having a greater depth than a thickness of the imaging device is formed in a surface of the embedded-component substrate, wherein the imaging device is bonded to a bottom of the recessed portion such that a surface of the imaging device is lower than the surface of the embedded-component substrate, thereby creating an opening above the surface of the imaging device, and wherein a connection pad on the imaging device is connected to a conductor pad disposed on the surface of the embedded-component substrate by a bonding wire that goes through the opening.