Leadless array plastic package with various IC packaging configurations

摘要

A leadless integrated circuit (IC) package comprising an IC chip mounted to a die-attach area and a plurality of electrical contacts electrically connected to the IC chip. The IC chip, the electrical contacts, and the die-attach area are all covered with a molding material, with portions of the electrical contacts and die-attach area protruding from a bottom surface of the molding material.

主权项

1. A method of manufacturing a semiconductor package comprising:
providing a leadframe strip having top and bottom surfaces and having recesses on the top surface partially defining upper portions of a plurality of electrical contacts; mounting a first IC chip to the leadframe strip; forming electrical connections between the plurality of partially defined electrical contacts and the first IC chip; forming a molding layer on the top surface of the leadframe strip, the molding layer filling the recesses; and removing a portion of the leadframe strip from the bottom surface to define lower portions of the plurality of electrical contacts.