| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing method of a wafer capable of efficiently dividing a wafer, in which devices are formed by functional layers laminated on the surface of a substrate, into individual devices.SOLUTION: Provided is a processing method of a wafer for dividing the wafer, in which devices are formed by functional layers laminated on the surface of a substrate, along a plurality of streets for sectioning the devices. The method includes a cutting groove formation step for forming cutting grooves while leaving a part not reaching a functional layer, by positioning a cutting blade in an area corresponding to the street from the rear side of the substrate, and a laser processing step for breaking the residual part of the substrate and the functional layer, by irradiation with a laser beam from the rear side of the substrate, subjected to the cutting groove formation step, along the bottom of the cutting groove. |
