THERMAL TRANSFER STRUCTURE WITH IN-PLANE TUBE LENGTHS AND OUT-OF-PLANE TUBE BEND(S)

摘要

Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to and cool one or more electronic components. The thermal transfer structure includes a thermal spreader, and at least one coolant-carrying tube coupled to the thermal spreader. The coolant-carrying tube(s) includes multiple tube lengths disposed substantially in a common plane, and an out-of-plane tube bend. The out-of-plane tube bend is couples in fluid communication first and second tube lengths of the multiple tube lengths, and extends out-of-plane from the multiple tube lengths disposed in the common plane. The first and second tube lengths may be spaced apart, with a third tube length disposed between them, and the coolant-carrying tube(s) further includes an in-plane tube bend which couples in fluid communication the third tube length and a fourth tube length of the multiple tube lengths.

主权项

1. A cooling apparatus comprising:
a thermal transfer structure, the thermal transfer structure comprising:
a thermal spreader; andat least one coolant-carrying tube coupled to and in thermal contact with the thermal spreader, the at least one coolant-carrying tube comprising:
multiple tube lengths disposed substantially in a common plane; andat last one out-of-plane tube bend, one out-of-plane tube bend of the at last one out-of-plane tube been coupling in fluid communication a first tube length and a second tube length of the multiple tube lengths, the one out-of-plane tube bend extending out-of-plane from the multiple tube lengths disposed in the common plane.