ELECTRONIC COMPONENT AND METHOD FOR FORMING JUNCTION STRUCTURE BETWEEN ELECTRONIC COMPONENT AND OBJECT TO BE JOINED

摘要

Disclosed is an electronic part which has excellent heat resistance of a soldered portion in mounting the electronic part by soldering, has good solder wettability of the external electrode, and can perform highly reliable mounting, and a method for forming a joint structure having high joint reliability and high heat resistance. In an electronic part A1 including an electronic part main body (ceramic laminate) 1 and an external electrode 5 formed on the surface of the electronic part main body 1, the external electrode includes at least one alloy layer 10 selected from among a Cu-Ni alloy layer and a Cu-Mn alloy layer, and an antioxidant film 20 which is formed on the outer side of the alloy layer. The antioxidant film includes a Sn-containing film containing Sn. The antioxidant film includes a noble metal film made of a noble metal. The antioxidant film includes an organic substance film made of an organic substance.