发明名称
摘要 A laminated circuit board includes a first wiring board that has a first land formed on a surface thereof; a second wiring board that has a second land formed on a surface thereof; a bonding layer that is made of a bonding resin, being laid between the first wiring board and the second wiring board, wherein the bonding layer electrically connects the first land and the second land via a conducting material; and a plate that has a through-hole into which the conducting material is supplied, wherein the plate has a resin accommodating space that accommodates therein an excess bonding resin that appears during layer stacking.
申请公布号 JP5581828(B2) 申请公布日期 2014.09.03
申请号 JP20100132395 申请日期 2010.06.09
申请人 发明人
分类号 H05K3/46;H05K1/11;H05K3/40 主分类号 H05K3/46
代理机构 代理人
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