| 发明名称 | Substrate processing method | ||
| 摘要 | A processing method of a substrate which includes: a first bonding step which bonds a ring-shaped first support member to a first surface of the substrate along the outer periphery of the substrate; a first processing step which processes the substrate; and a first separating step which separates the first support member from the substrate by separation at the bonded position. | ||
| 申请公布号 | US8821737(B2) | 申请公布日期 | 2014.09.02 |
| 申请号 | US201213357893 | 申请日期 | 2012.01.25 |
| 申请人 | Seiko Epson Corporation | 发明人 | Jiromaru Tomohiro;Takeuchi Junichi |
| 分类号 | C03C15/00;B44C1/22 | 主分类号 | C03C15/00 |
| 代理机构 | Harness, Dickey & Pierce, P.L.C. | 代理人 | Harness, Dickey & Pierce, P.L.C. |
| 主权项 | 1. A processing method of a substrate comprising: a first bonding step which bonds a first support member to a first surface of the substrate such that the first support member covers the first surface of the substrate; a first processing step which performs a first treatment on a second surface of the substrate, the second surface being opposite to the first surface; a first separating step which separates the first support member from the substrate; a second bonding step which bonds a ring-shaped second support member to the first surface of the substrate along an outer periphery of the substrate after the first support member is separated from the substrate; a second processing step which performs a second treatment on the first and second surfaces of the substrate; and a second separating step which separates the ring-shaped second support member from the substrate. | ||
| 地址 | JP | ||