Electronic package structure

摘要

An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.

主权项

1. An electronic package, comprising:
an electronic element; a lead frame having a plurality of leads, each of said leads having
a top section electrically coupled to said electronic element,a bottom section, anda middle section connecting said top section and said bottom section to define a bracket shape; a coil bracketed by said leads, wherein the coil is below the top section and above the bottom section of each of said leads; a body encapsulating at least said coil, said body having a bottom face on which the bottom sections of the leads are positioned and exposed; a first electrode electrically coupled to a first end of said coil; a second electrode electrically coupled to a second end of said coil; and wherein in each of said leads, the top section extends inwardly from a top end of the middle section toward a middle part of the body, and the bottom section extends inwardly from a bottom end of the middle section toward the middle part of the body; a first bottom of said first electrode protrudes from the bottom face in the middle part of said body; a second bottom of said second electrode protrudes from the bottom face in the middle part of said body; on the bottom face of the body, the bottom sections of said leads extend inwardly from opposite sides toward the first and second bottoms of said first and second electrodes in the middle part of the body; and said bottom sections of the leads and the first and second bottoms of the first and second electrodes have undersides that are coplanar to define said package as a surface-mount package.