Defect observation method and defect observation device

摘要

A defect observation device including an input-output unit supplied with information of a taught defect, and information of an ideal output of the taught defect, and configured to display a processing result based upon a determined image processing parameter set; and an automatic determination unit configured to: select image processing parameter sets which are less in number than the total number of all image processing parameter sets, out of all image processing parameter sets, calculate image processing results on an input defect image, by using the selected image processing parameter sets, calculate a coincidence degree for each of the selected image processing parameter sets, estimate distribution of an index value in all image processing parameter sets from distribution of the coincidence degree for the selected image processing parameter sets, and determine an image processing parameter set to have a high coincidence degree out of all image processing parameter sets.

主权项

1. A defect observation method for observing a defect of a sample, comprising the steps of:
picking up a plurality of defect images by using an electron microscope on the basis of previously detected defect coordinates of a sample; processing a teaching defect image selected out of the plurality of picked up defect images, by using respective conditions of a first plurality of image processing parameter sets which are previously set, and extracting a plurality of defect areas respectively corresponding to the first plurality of image processing parameter sets; comparing an ideal defect area which is set to correspond to the selected teaching defect image with the extracted plurality of defect areas and calculating a coincidence degree every the plurality of defect areas; calculating an estimated value of coincidence degree with respect to each of a second plurality of image processing parameter sets different from the first plurality of image processing parameter sets which are previously set, by using the coincidence degree calculated for each of the plurality of defect areas; selecting one or a plurality of image processing parameter sets out of the first plurality of image processing parameter sets which are previously set and the second plurality of image processing parameter sets on the basis of the calculated plurality of coincidence degrees and estimated values of coincidence degree; and conducting image processing on the plurality of defect images picked up with the electron microscope by using the selected image processing parameter set and classifying the defect of the sample on the basis of the defect images subjected to the image processing.