| 摘要 |
PROBLEM TO BE SOLVED: To improve versatility of a lead frame used for manufacturing a semiconductor device in which one end part in a longitudinal direction of a lead is electrically connected to a semiconductor chip, and then the one end part of the lead and the semiconductor chip are encapsulated by a mold resin, and the other end part of the lead is extended from the mold resin.SOLUTION: Provided is a lead frame 1 comprising: a plurality of lead main body parts 12 formed so as to extend in a longitudinal direction, and arranged at an interval in a width direction orthogonal to a longitudinal direction to configure a lead of a semiconductor device; a frame body part 13 connected to a middle part in the longitudinal direction of each lead main body part 12 to integrally couple the plurality of lead main body parts 12; and a lead widening part 15 integrally formed to the other end parts 24 in the longitudinal direction of two lead main body parts 12 adjacent to each other. |
