发明名称 |
ARRAY SUBSTRATE AND PANEL |
摘要 |
An array substrate includes a common electrode line located in a surrounding region, a protected structure located inside the common electrode line, and a first electrostatic protection circuit having a shorting bar electrically connected between the protected structure and the common electrode line for releasing static electricity on the protected structure. A second electrostatic protection circuit is also electrically connected between the protected structure and the common electrode line, and the second electrostatic protection circuit releases static electricity through the common electrode line after the shorting bar is cut off. The invention can make the conduction of the static electricity accumulated at the shorting bar that has been cut off change from unidirectional conduction toward inside of the array substrate to bidirectional conduction toward inside of the array substrate and edges of the array substrate, thus reducing the probability of electrostatic damage to internal devices of the array substrate. |
申请公布号 |
US2014240889(A1) |
申请公布日期 |
2014.08.28 |
申请号 |
US201314090889 |
申请日期 |
2013.11.26 |
申请人 |
Tianma Micro-Electronics Co., Ltd. ;Shanghai Tianma Micro-Electronics Co., Ltd. |
发明人 |
ZHENG Lipeng |
分类号 |
H05F3/02 |
主分类号 |
H05F3/02 |
代理机构 |
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代理人 |
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主权项 |
1. An array substrate, comprising:
a common electrode line located in a surrounding region, a protected structure located inside the common electrode line, and a first electrostatic protection circuit having a shorting bar electrically connected between the protected structure and the common electrode line for releasing static electricity on the protected structure, wherein a second electrostatic protection circuit is also electrically connected between the protected structure and the common electrode line, and the second electrostatic protection circuit releases static electricity through the common electrode line after the shorting bar is cut off. |
地址 |
Shenzhen CN |