POWER ELECTRONIC DEVICE

摘要

A device includes a first and second transistors integrated in first and second chips. Each chip has opposed rear and front surfaces, and further has a first conduction terminal and a control terminal on the front surface and a second conduction terminal on the rear surface. The first and second transistors are electrically connected in series by having the first conduction terminals of the first and second transistors be electrically connected. The device includes a common package enclosing the first and second chips, the common package having an insulating body with a mounting surface. A heat sink is also enclosed within the insulating body, the heat sink making electrical contact with the first conduction terminals of the first and second chips on the respective front surfaces, so that the first conduction terminals are electrically connected together through the heat sink.

主权项

1. An electronic device, comprising:
a first transistor integrated in a first chip; a second transistor integrated in a second chip; wherein each chip has a rear surface and a front surface opposite to each other, a first conduction terminal and a control terminal of the corresponding transistor on the front surface and a second conduction terminal of the corresponding transistor on the rear surface, the first transistor and the second transistor being connected with the first conduction terminal of the first transistor connected to the first conduction terminal of the second transistor; a common package comprising an insulating body enclosing the first transistor and the second transistor and having a mounting surface; and a heat sink enclosed in the insulating body in contact with the first conduction terminals of the first and second chips on the respective front surfaces, so that the first conduction terminals are electrically connected together by means of the heat sink.