EPOXY COMPOUND HAVING ALKOXYSILYL GROUP, METHOD FOR MANUFACTURING SAME, COMPOSITION AND CURED PRODUCT INCLUDING SAME, AND USE THEREOF

摘要

The present invention relates to: an alkoxysilyl-based epoxy compound exhibiting excellent heat resistance, in particular, a low coefficient of thermal expansion (CTE) and a high glass transition synergistic effect in a composite, and/or excellent flame retardancy in a cured product, and not requiring a separate silane coupling agent; a method for manufacturing the same; and a composition and a cured product including the same. According to the present invention, provided are: an epoxy compound containing the alkoxysilyl group, having, at the core, an epoxy group and at least one alkoxysilyl group, which is either a S1 substituent independently selected from a group consisting of formulas S11-S15 or an S2 substituent independently selected from a group consisting of formulas S21-S25; a method for manufacturing the alkoxysilyl-based epoxy compound manufactured by using an epoxy ring-opening reaction of a starting material and alkoxysilylation; an epoxy composition containing the epoxy compound; a cured product thereof; and a use thereof. According to the present invention, the cured product, which is a composite of a composition containing a novel alkoxysilyl-based epoxy compound, improves chemical bonding efficiency when forming a composite by chemical bonding between the alkoxysilyl group in the epoxy compound and a filler and by chemical bonding between each alkoxysilyl group in the alkoxysilyl group-containing epoxy compound. Therefore, the present invention exhibits a low CTE and excellent heat resistance of a high glass transition temperature, in a composite, and/or excellent flame retardancy in a cured product.