COPPER FINE PARTICLE DISPERSION SOLUTION, MANUFACTURING METHOD OF SINTERED CONDUCTOR, AND MANUFACTURING METHOD OF CONDUCTOR CONNECTION MEMBER

摘要

PROBLEM TO BE SOLVED: To provide a copper fine particle dispersion solution capable of providing a conductive member excellent in conductivity even with sintering at low temperature.SOLUTION: In a copper fine particle dispersion solution, at least, copper fine particles each having a particle diameter of a primary particle in a range of 1 to 300 nm and coated with a low molecular organic compound having a lactam structure and 4 to 12 carbon atoms, and a copper fine particles each having a core/shell structure with a core part of Cu and a shell part of copper oxide, this copper fine particle having an X-ray diffraction peak intensity ratio (H/[H+H]) of 0.09 to 0.75, where Hdenotes a peak height of Cu (111) face and Hdenotes a peak height of CuO (111) face, in an X-ray diffraction measurement, are dispersed in an organic solvent (S) containing an organic compound (S1) having at least one hydroxyl group.