SEMICONDUCTOR DEVICE WITH INTEGRAL HEAT SINK

摘要

A packaged semiconductor device has opposing first and second main surfaces and a sidewall connecting the first and second main surfaces. A semiconductor die is embedded in the package and has a first main surface facing the first main surface of the package and an opposing second main surface facing the second main surface of the package. Conductive leads are electrically coupled to the semiconductor die, each of which is partially embedded within the package and extends outside of the package from the package sidewall. At least one tie bar is partially embedded within the package and has an exposed segment extending outside of the package from the sidewall. A portion of the exposed segment is in contact with the first main surface of the package. The tie bar forms a heat sink to dissipate heat generated by the semiconductor die.

主权项

1. A semiconductor device, comprising:
a package having opposing first and second main surfaces and a sidewall connecting the first and second main surfaces; a semiconductor die embedded in the package and having a first main surface facing the first main surface of the package and an opposing second main surface facing the second main surface of the package; a plurality of conductive leads electrically coupled to the semiconductor die, each of which is partially embedded within the package and extends outside of the package from the sidewall thereof; and at least one tie bar partially embedded within the package and having an exposed segment extending outside of the package from the sidewall, a portion of the exposed segment being in contact with the first main surface of the package, wherein the at least one tie bar forms a heat sink to conduct heat generated by the semiconductor die.